Males fight over females and feeding sites, but they are not very aggressive otherwise. They grapple with their horns, and the winner is whoever first lifts his opponent off his feet and knocks him over. Two males will approach each other to compete, often in a tree.

The hercules beetle (Dynastes hercules) takes second in size compared to the rhinoceros, and the hercules has a second long horn curving down towards the lower one. This rhinoceros can fly short distances, although its heavy body makes it rather ungraceful in flight. The light to dark brown rhinoceros beetle can look almost velvety because it has fine, short hairs over the exoskeleton. Females are smaller and do not have such a dramatically adorned head. He has additional, shorter horns that project out from his head, but the long one is used for fighting. The male is unmistakable with his massive size and long, intimidating horn that curves up. The rhino is one of the strongest insects in the world with relation to its body size, and is the largest beetle within countries like Costa Rica. The rhinoceros beetle can be found from southern Mexico down to northern Colombia and northern Venezuela. In younger stages, it lives inside large fallen trees. Huawei has not commented on the matter, and even state-ran Global Times does not explicitly say that the HiSilicon Kirin 9000S uses SMIC's 5nm-class process technology but prefers to call the information a rumor.Lowland rainforest is suitable for this beetle, but mature forest is required for the beetle to survive.

If this is the case, then the Kirin 9000S is the first fruit of this collaboration. After Huawei lost access to American technologies in 2020, HiSilicon could no longer work with the world's largest contract maker of chips, and it is believed that the parent company helped SMIC to advance its fabrication processes. Huawei's HiSilicon is China's most successful chip designer that has used to adopt TSMC's leading-edge fabrication technologies. But in any case, advanced packaging technology is also a breakthrough for SMIC and/or Huawei's HiSilicon. Perhaps the Kirin 9000S stacks the modem IC on top of the CPU+GPU IC to save space on the motherboard, or maybe disaggregates some logic to simplify production. There is an essential detail, though: to print outstanding features on a 5nm-class node or a refined 7nm-class process technology, SMIC has to heavily use multi-patterning, which is an expensive technology that affects yields and costs, so the economic efficiency of SMIC's 5nm-class technology is likely considerably lower than that of market leaders Intel, TSMC, and Samsung Foundry.Īn interesting detail about the Kirin 9000S is that it reportedly uses stacking technology, though Global Times does not elaborate on how it uses stacking. Meanwhile, SMIC's Twinscan NXT:2000i deep ultraviolet (DUV) lithography scanners can make chips on 7nm and 5nm technologies, so that the company may have developed a 5nm-class fabrication process. But these two names seem to describe the same thing, which was once known as SMIC's N+2.

Although TechInsights calls this fabrication technology SMIC's 2nd generation production node, state-controlled Global Times claims that China's foundry champion uses its 5nm-class manufacturing technology to make the SoC. CPU and GPU cores run at relatively low clocks compared to frequencies of Arm's cores featured in previous generations of HiSilicon's SoCs.īut low frequencies can be explained by the fact that SMIC makes the new SoC on its unannounced 2nd generation 7nm fabrication process, which could be a breakthrough for SMIC, Huawei, and China's high-tech industry. Huawei's HiSilicon Kirin 9000S looks to be a quite complex SoC packing four high-performance cores (one at up to 2.62 GHz and two at up to 2,150 MHz) and four energy-efficient cores (up to 1,530 MHz) based on the company's own TaiShan microarchitecture (which still looks to be found on the Armv8a ISA ) as well as the Maleoon 910 graphics processing unit operating at up to 750 MHz, based on screenshots by Huawei Central.

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